The global Plating for Microelectronics market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
This report is a detailed and comprehensive analysis for global Plating for Microelectronics market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Plating for Microelectronics market size and forecasts, in consumption value ($ Million), 2020-2031
Global Plating for Microelectronics market size and forecasts by region and country, in consumption value ($ Million), 2020-2031
Global Plating for Microelectronics market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031
Global Plating for Microelectronics market shares of main players, in revenue ($ Million), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Plating for Microelectronics
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Plating for Microelectronics market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DOW, Mitsubishi Materials Corporation, Heraeus, XiLong Scientific, Atotech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 segmentation
Plating for Microelectronics market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
麻豆原创 segment by Application
MEMS
PCB
IC
Photoelectron
Others
麻豆原创 segment by players, this report covers
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
麻豆原创 segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Plating for Microelectronics product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Plating for Microelectronics, with revenue, gross margin, and global market share of Plating for Microelectronics from 2020 to 2025.
Chapter 3, the Plating for Microelectronics competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Plating for Microelectronics market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Plating for Microelectronics.
Chapter 13, to describe Plating for Microelectronics research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 Classification of Plating for Microelectronics by Type
1.3.1 Overview: Global Plating for Microelectronics 麻豆原创 Size by Type: 2020 Versus 2024 Versus 2031
1.3.2 Global Plating for Microelectronics Consumption Value 麻豆原创 Share by Type in 2024
1.3.3 Gold
1.3.4 Zinc
1.3.5 Nickel
1.3.6 Bronze
1.3.7 Tin
1.3.8 Copper
1.3.9 Others
1.4 Global Plating for Microelectronics 麻豆原创 by Application
1.4.1 Overview: Global Plating for Microelectronics 麻豆原创 Size by Application: 2020 Versus 2024 Versus 2031
1.4.2 MEMS
1.4.3 PCB
1.4.4 IC
1.4.5 Photoelectron
1.4.6 Others
1.5 Global Plating for Microelectronics 麻豆原创 Size & Forecast
1.6 Global Plating for Microelectronics 麻豆原创 Size and Forecast by Region
1.6.1 Global Plating for Microelectronics 麻豆原创 Size by Region: 2020 VS 2024 VS 2031
1.6.2 Global Plating for Microelectronics 麻豆原创 Size by Region, (2020-2031)
1.6.3 North America Plating for Microelectronics 麻豆原创 Size and Prospect (2020-2031)
1.6.4 Europe Plating for Microelectronics 麻豆原创 Size and Prospect (2020-2031)
1.6.5 Asia-Pacific Plating for Microelectronics 麻豆原创 Size and Prospect (2020-2031)
1.6.6 South America Plating for Microelectronics 麻豆原创 Size and Prospect (2020-2031)
1.6.7 Middle East & Africa Plating for Microelectronics 麻豆原创 Size and Prospect (2020-2031)
2 Company Profiles
2.1 DOW
2.1.1 DOW Details
2.1.2 DOW Major Business
2.1.3 DOW Plating for Microelectronics Product and Solutions
2.1.4 DOW Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.1.5 DOW Recent Developments and Future Plans
2.2 Mitsubishi Materials Corporation
2.2.1 Mitsubishi Materials Corporation Details
2.2.2 Mitsubishi Materials Corporation Major Business
2.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Product and Solutions
2.2.4 Mitsubishi Materials Corporation Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.2.5 Mitsubishi Materials Corporation Recent Developments and Future Plans
2.3 Heraeus
2.3.1 Heraeus Details
2.3.2 Heraeus Major Business
2.3.3 Heraeus Plating for Microelectronics Product and Solutions
2.3.4 Heraeus Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.3.5 Heraeus Recent Developments and Future Plans
2.4 XiLong Scientific
2.4.1 XiLong Scientific Details
2.4.2 XiLong Scientific Major Business
2.4.3 XiLong Scientific Plating for Microelectronics Product and Solutions
2.4.4 XiLong Scientific Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.4.5 XiLong Scientific Recent Developments and Future Plans
2.5 Atotech
2.5.1 Atotech Details
2.5.2 Atotech Major Business
2.5.3 Atotech Plating for Microelectronics Product and Solutions
2.5.4 Atotech Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.5.5 Atotech Recent Developments and Future Plans
2.6 Yamato Denki
2.6.1 Yamato Denki Details
2.6.2 Yamato Denki Major Business
2.6.3 Yamato Denki Plating for Microelectronics Product and Solutions
2.6.4 Yamato Denki Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.6.5 Yamato Denki Recent Developments and Future Plans
2.7 Meltex
2.7.1 Meltex Details
2.7.2 Meltex Major Business
2.7.3 Meltex Plating for Microelectronics Product and Solutions
2.7.4 Meltex Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.7.5 Meltex Recent Developments and Future Plans
2.8 Ishihara Chemical
2.8.1 Ishihara Chemical Details
2.8.2 Ishihara Chemical Major Business
2.8.3 Ishihara Chemical Plating for Microelectronics Product and Solutions
2.8.4 Ishihara Chemical Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.8.5 Ishihara Chemical Recent Developments and Future Plans
2.9 Raschig GmbH
2.9.1 Raschig GmbH Details
2.9.2 Raschig GmbH Major Business
2.9.3 Raschig GmbH Plating for Microelectronics Product and Solutions
2.9.4 Raschig GmbH Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.9.5 Raschig GmbH Recent Developments and Future Plans
2.10 Japan Pure Chemical
2.10.1 Japan Pure Chemical Details
2.10.2 Japan Pure Chemical Major Business
2.10.3 Japan Pure Chemical Plating for Microelectronics Product and Solutions
2.10.4 Japan Pure Chemical Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.10.5 Japan Pure Chemical Recent Developments and Future Plans
2.11 Coatech
2.11.1 Coatech Details
2.11.2 Coatech Major Business
2.11.3 Coatech Plating for Microelectronics Product and Solutions
2.11.4 Coatech Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.11.5 Coatech Recent Developments and Future Plans
2.12 MAGNETO special anodes
2.12.1 MAGNETO special anodes Details
2.12.2 MAGNETO special anodes Major Business
2.12.3 MAGNETO special anodes Plating for Microelectronics Product and Solutions
2.12.4 MAGNETO special anodes Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.12.5 MAGNETO special anodes Recent Developments and Future Plans
2.13 Vopelius Chemie AG
2.13.1 Vopelius Chemie AG Details
2.13.2 Vopelius Chemie AG Major Business
2.13.3 Vopelius Chemie AG Plating for Microelectronics Product and Solutions
2.13.4 Vopelius Chemie AG Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.13.5 Vopelius Chemie AG Recent Developments and Future Plans
2.14 Moses Lake Industries
2.14.1 Moses Lake Industries Details
2.14.2 Moses Lake Industries Major Business
2.14.3 Moses Lake Industries Plating for Microelectronics Product and Solutions
2.14.4 Moses Lake Industries Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.14.5 Moses Lake Industries Recent Developments and Future Plans
2.15 JCU International
2.15.1 JCU International Details
2.15.2 JCU International Major Business
2.15.3 JCU International Plating for Microelectronics Product and Solutions
2.15.4 JCU International Plating for Microelectronics Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.15.5 JCU International Recent Developments and Future Plans
3 麻豆原创 Competition, by Players
3.1 Global Plating for Microelectronics Revenue and Share by Players (2020-2025)
3.2 麻豆原创 Share Analysis (2024)
3.2.1 麻豆原创 Share of Plating for Microelectronics by Company Revenue
3.2.2 Top 3 Plating for Microelectronics Players 麻豆原创 Share in 2024
3.2.3 Top 6 Plating for Microelectronics Players 麻豆原创 Share in 2024
3.3 Plating for Microelectronics 麻豆原创: Overall Company Footprint Analysis
3.3.1 Plating for Microelectronics 麻豆原创: Region Footprint
3.3.2 Plating for Microelectronics 麻豆原创: Company Product Type Footprint
3.3.3 Plating for Microelectronics 麻豆原创: Company Product Application Footprint
3.4 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 麻豆原创 Size Segment by Type
4.1 Global Plating for Microelectronics Consumption Value and 麻豆原创 Share by Type (2020-2025)
4.2 Global Plating for Microelectronics 麻豆原创 Forecast by Type (2026-2031)
5 麻豆原创 Size Segment by Application
5.1 Global Plating for Microelectronics Consumption Value 麻豆原创 Share by Application (2020-2025)
5.2 Global Plating for Microelectronics 麻豆原创 Forecast by Application (2026-2031)
6 North America
6.1 North America Plating for Microelectronics Consumption Value by Type (2020-2031)
6.2 North America Plating for Microelectronics 麻豆原创 Size by Application (2020-2031)
6.3 North America Plating for Microelectronics 麻豆原创 Size by Country
6.3.1 North America Plating for Microelectronics Consumption Value by Country (2020-2031)
6.3.2 United States Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
6.3.3 Canada Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
6.3.4 Mexico Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
7 Europe
7.1 Europe Plating for Microelectronics Consumption Value by Type (2020-2031)
7.2 Europe Plating for Microelectronics Consumption Value by Application (2020-2031)
7.3 Europe Plating for Microelectronics 麻豆原创 Size by Country
7.3.1 Europe Plating for Microelectronics Consumption Value by Country (2020-2031)
7.3.2 Germany Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
7.3.3 France Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
7.3.4 United Kingdom Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
7.3.5 Russia Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
7.3.6 Italy Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8 Asia-Pacific
8.1 Asia-Pacific Plating for Microelectronics Consumption Value by Type (2020-2031)
8.2 Asia-Pacific Plating for Microelectronics Consumption Value by Application (2020-2031)
8.3 Asia-Pacific Plating for Microelectronics 麻豆原创 Size by Region
8.3.1 Asia-Pacific Plating for Microelectronics Consumption Value by Region (2020-2031)
8.3.2 China Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8.3.3 Japan Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8.3.4 South Korea Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8.3.5 India Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8.3.6 Southeast Asia Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
8.3.7 Australia Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
9 South America
9.1 South America Plating for Microelectronics Consumption Value by Type (2020-2031)
9.2 South America Plating for Microelectronics Consumption Value by Application (2020-2031)
9.3 South America Plating for Microelectronics 麻豆原创 Size by Country
9.3.1 South America Plating for Microelectronics Consumption Value by Country (2020-2031)
9.3.2 Brazil Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
9.3.3 Argentina Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
10 Middle East & Africa
10.1 Middle East & Africa Plating for Microelectronics Consumption Value by Type (2020-2031)
10.2 Middle East & Africa Plating for Microelectronics Consumption Value by Application (2020-2031)
10.3 Middle East & Africa Plating for Microelectronics 麻豆原创 Size by Country
10.3.1 Middle East & Africa Plating for Microelectronics Consumption Value by Country (2020-2031)
10.3.2 Turkey Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
10.3.3 Saudi Arabia Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
10.3.4 UAE Plating for Microelectronics 麻豆原创 Size and Forecast (2020-2031)
11 麻豆原创 Dynamics
11.1 Plating for Microelectronics 麻豆原创 Drivers
11.2 Plating for Microelectronics 麻豆原创 Restraints
11.3 Plating for Microelectronics Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Plating for Microelectronics Industry Chain
12.2 Plating for Microelectronics Upstream Analysis
12.3 Plating for Microelectronics Midstream Analysis
12.4 Plating for Microelectronics Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
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*If Applicable.
