The global Metal Shell for Microelectronic Packages market size was valued at US$ 2048 million in 2024 and is forecast to a readjusted size of USD 2034 million by 2031 with a CAGR of -0.1% during review period.
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.
Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.
Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; 鈶� has good heat conduction and heat dissipation; 鈶� good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; 鈶� Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.
In terms of market sales, China accounts for 22% of global market share.
In terms of suppliers, the world"s leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.
In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.
This report is a detailed and comprehensive analysis for global Metal Shell for Microelectronic Packages market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Metal Shell for Microelectronic Packages market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Metal Shell for Microelectronic Packages market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Metal Shell for Microelectronic Packages market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2020-2031
Global Metal Shell for Microelectronic Packages market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Metal Shell for Microelectronic Packages
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Metal Shell for Microelectronic Packages market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, KaiRui, Jiangsu Dongguang Micro-electronics, Taizhou Hangyu Electric Appliance, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 Segmentation
Metal Shell for Microelectronic Packages market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
TO Shell
Flat Shell
麻豆原创 segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other
Major players covered
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
麻豆原创 segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Metal Shell for Microelectronic Packages product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Metal Shell for Microelectronic Packages, with price, sales quantity, revenue, and global market share of Metal Shell for Microelectronic Packages from 2020 to 2025.
Chapter 3, the Metal Shell for Microelectronic Packages competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Metal Shell for Microelectronic Packages breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Metal Shell for Microelectronic Packages market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Metal Shell for Microelectronic Packages.
Chapter 14 and 15, to describe Metal Shell for Microelectronic Packages sales channel, distributors, customers, research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 麻豆原创 Analysis by Type
1.3.1 Overview: Global Metal Shell for Microelectronic Packages Consumption Value by Type: 2020 Versus 2024 Versus 2031
1.3.2 TO Shell
1.3.3 Flat Shell
1.4 麻豆原创 Analysis by Application
1.4.1 Overview: Global Metal Shell for Microelectronic Packages Consumption Value by Application: 2020 Versus 2024 Versus 2031
1.4.2 Aeronautics and Astronautics
1.4.3 Petrochemical Industry
1.4.4 Automobile
1.4.5 Optical Communication
1.4.6 Other
1.5 Global Metal Shell for Microelectronic Packages 麻豆原创 Size & Forecast
1.5.1 Global Metal Shell for Microelectronic Packages Consumption Value (2020 & 2024 & 2031)
1.5.2 Global Metal Shell for Microelectronic Packages Sales Quantity (2020-2031)
1.5.3 Global Metal Shell for Microelectronic Packages Average Price (2020-2031)
2 Manufacturers Profiles
2.1 AMETEK(GSP)
2.1.1 AMETEK(GSP) Details
2.1.2 AMETEK(GSP) Major Business
2.1.3 AMETEK(GSP) Metal Shell for Microelectronic Packages Product and Services
2.1.4 AMETEK(GSP) Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.1.5 AMETEK(GSP) Recent Developments/Updates
2.2 SCHOTT
2.2.1 SCHOTT Details
2.2.2 SCHOTT Major Business
2.2.3 SCHOTT Metal Shell for Microelectronic Packages Product and Services
2.2.4 SCHOTT Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.2.5 SCHOTT Recent Developments/Updates
2.3 Complete Hermetics
2.3.1 Complete Hermetics Details
2.3.2 Complete Hermetics Major Business
2.3.3 Complete Hermetics Metal Shell for Microelectronic Packages Product and Services
2.3.4 Complete Hermetics Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.3.5 Complete Hermetics Recent Developments/Updates
2.4 KOTO
2.4.1 KOTO Details
2.4.2 KOTO Major Business
2.4.3 KOTO Metal Shell for Microelectronic Packages Product and Services
2.4.4 KOTO Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.4.5 KOTO Recent Developments/Updates
2.5 Kyocera
2.5.1 Kyocera Details
2.5.2 Kyocera Major Business
2.5.3 Kyocera Metal Shell for Microelectronic Packages Product and Services
2.5.4 Kyocera Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.5.5 Kyocera Recent Developments/Updates
2.6 SGA Technologies
2.6.1 SGA Technologies Details
2.6.2 SGA Technologies Major Business
2.6.3 SGA Technologies Metal Shell for Microelectronic Packages Product and Services
2.6.4 SGA Technologies Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.6.5 SGA Technologies Recent Developments/Updates
2.7 Century Seals
2.7.1 Century Seals Details
2.7.2 Century Seals Major Business
2.7.3 Century Seals Metal Shell for Microelectronic Packages Product and Services
2.7.4 Century Seals Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.7.5 Century Seals Recent Developments/Updates
2.8 KaiRui
2.8.1 KaiRui Details
2.8.2 KaiRui Major Business
2.8.3 KaiRui Metal Shell for Microelectronic Packages Product and Services
2.8.4 KaiRui Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.8.5 KaiRui Recent Developments/Updates
2.9 Jiangsu Dongguang Micro-electronics
2.9.1 Jiangsu Dongguang Micro-electronics Details
2.9.2 Jiangsu Dongguang Micro-electronics Major Business
2.9.3 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Product and Services
2.9.4 Jiangsu Dongguang Micro-electronics Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.9.5 Jiangsu Dongguang Micro-electronics Recent Developments/Updates
2.10 Taizhou Hangyu Electric Appliance
2.10.1 Taizhou Hangyu Electric Appliance Details
2.10.2 Taizhou Hangyu Electric Appliance Major Business
2.10.3 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Product and Services
2.10.4 Taizhou Hangyu Electric Appliance Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.10.5 Taizhou Hangyu Electric Appliance Recent Developments/Updates
2.11 CETC40
2.11.1 CETC40 Details
2.11.2 CETC40 Major Business
2.11.3 CETC40 Metal Shell for Microelectronic Packages Product and Services
2.11.4 CETC40 Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.11.5 CETC40 Recent Developments/Updates
2.12 BOJING ELECTRONICS
2.12.1 BOJING ELECTRONICS Details
2.12.2 BOJING ELECTRONICS Major Business
2.12.3 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Product and Services
2.12.4 BOJING ELECTRONICS Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.12.5 BOJING ELECTRONICS Recent Developments/Updates
2.13 CETC43
2.13.1 CETC43 Details
2.13.2 CETC43 Major Business
2.13.3 CETC43 Metal Shell for Microelectronic Packages Product and Services
2.13.4 CETC43 Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.13.5 CETC43 Recent Developments/Updates
2.14 SINOPIONEER
2.14.1 SINOPIONEER Details
2.14.2 SINOPIONEER Major Business
2.14.3 SINOPIONEER Metal Shell for Microelectronic Packages Product and Services
2.14.4 SINOPIONEER Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.14.5 SINOPIONEER Recent Developments/Updates
2.15 CCTC
2.15.1 CCTC Details
2.15.2 CCTC Major Business
2.15.3 CCTC Metal Shell for Microelectronic Packages Product and Services
2.15.4 CCTC Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.15.5 CCTC Recent Developments/Updates
2.16 XingChuang
2.16.1 XingChuang Details
2.16.2 XingChuang Major Business
2.16.3 XingChuang Metal Shell for Microelectronic Packages Product and Services
2.16.4 XingChuang Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.16.5 XingChuang Recent Developments/Updates
2.17 Rizhao Xuri Electronics Co., Ltd.
2.17.1 Rizhao Xuri Electronics Co., Ltd. Details
2.17.2 Rizhao Xuri Electronics Co., Ltd. Major Business
2.17.3 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Product and Services
2.17.4 Rizhao Xuri Electronics Co., Ltd. Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.17.5 Rizhao Xuri Electronics Co., Ltd. Recent Developments/Updates
2.18 ShengDa Technology
2.18.1 ShengDa Technology Details
2.18.2 ShengDa Technology Major Business
2.18.3 ShengDa Technology Metal Shell for Microelectronic Packages Product and Services
2.18.4 ShengDa Technology Metal Shell for Microelectronic Packages Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.18.5 ShengDa Technology Recent Developments/Updates
3 Competitive Environment: Metal Shell for Microelectronic Packages by Manufacturer
3.1 Global Metal Shell for Microelectronic Packages Sales Quantity by Manufacturer (2020-2025)
3.2 Global Metal Shell for Microelectronic Packages Revenue by Manufacturer (2020-2025)
3.3 Global Metal Shell for Microelectronic Packages Average Price by Manufacturer (2020-2025)
3.4 麻豆原创 Share Analysis (2024)
3.4.1 Producer Shipments of Metal Shell for Microelectronic Packages by Manufacturer Revenue ($MM) and 麻豆原创 Share (%): 2024
3.4.2 Top 3 Metal Shell for Microelectronic Packages Manufacturer 麻豆原创 Share in 2024
3.4.3 Top 6 Metal Shell for Microelectronic Packages Manufacturer 麻豆原创 Share in 2024
3.5 Metal Shell for Microelectronic Packages 麻豆原创: Overall Company Footprint Analysis
3.5.1 Metal Shell for Microelectronic Packages 麻豆原创: Region Footprint
3.5.2 Metal Shell for Microelectronic Packages 麻豆原创: Company Product Type Footprint
3.5.3 Metal Shell for Microelectronic Packages 麻豆原创: Company Product Application Footprint
3.6 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Metal Shell for Microelectronic Packages 麻豆原创 Size by Region
4.1.1 Global Metal Shell for Microelectronic Packages Sales Quantity by Region (2020-2031)
4.1.2 Global Metal Shell for Microelectronic Packages Consumption Value by Region (2020-2031)
4.1.3 Global Metal Shell for Microelectronic Packages Average Price by Region (2020-2031)
4.2 North America Metal Shell for Microelectronic Packages Consumption Value (2020-2031)
4.3 Europe Metal Shell for Microelectronic Packages Consumption Value (2020-2031)
4.4 Asia-Pacific Metal Shell for Microelectronic Packages Consumption Value (2020-2031)
4.5 South America Metal Shell for Microelectronic Packages Consumption Value (2020-2031)
4.6 Middle East & Africa Metal Shell for Microelectronic Packages Consumption Value (2020-2031)
5 麻豆原创 Segment by Type
5.1 Global Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
5.2 Global Metal Shell for Microelectronic Packages Consumption Value by Type (2020-2031)
5.3 Global Metal Shell for Microelectronic Packages Average Price by Type (2020-2031)
6 麻豆原创 Segment by Application
6.1 Global Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
6.2 Global Metal Shell for Microelectronic Packages Consumption Value by Application (2020-2031)
6.3 Global Metal Shell for Microelectronic Packages Average Price by Application (2020-2031)
7 North America
7.1 North America Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
7.2 North America Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
7.3 North America Metal Shell for Microelectronic Packages 麻豆原创 Size by Country
7.3.1 North America Metal Shell for Microelectronic Packages Sales Quantity by Country (2020-2031)
7.3.2 North America Metal Shell for Microelectronic Packages Consumption Value by Country (2020-2031)
7.3.3 United States 麻豆原创 Size and Forecast (2020-2031)
7.3.4 Canada 麻豆原创 Size and Forecast (2020-2031)
7.3.5 Mexico 麻豆原创 Size and Forecast (2020-2031)
8 Europe
8.1 Europe Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
8.2 Europe Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
8.3 Europe Metal Shell for Microelectronic Packages 麻豆原创 Size by Country
8.3.1 Europe Metal Shell for Microelectronic Packages Sales Quantity by Country (2020-2031)
8.3.2 Europe Metal Shell for Microelectronic Packages Consumption Value by Country (2020-2031)
8.3.3 Germany 麻豆原创 Size and Forecast (2020-2031)
8.3.4 France 麻豆原创 Size and Forecast (2020-2031)
8.3.5 United Kingdom 麻豆原创 Size and Forecast (2020-2031)
8.3.6 Russia 麻豆原创 Size and Forecast (2020-2031)
8.3.7 Italy 麻豆原创 Size and Forecast (2020-2031)
9 Asia-Pacific
9.1 Asia-Pacific Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
9.2 Asia-Pacific Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
9.3 Asia-Pacific Metal Shell for Microelectronic Packages 麻豆原创 Size by Region
9.3.1 Asia-Pacific Metal Shell for Microelectronic Packages Sales Quantity by Region (2020-2031)
9.3.2 Asia-Pacific Metal Shell for Microelectronic Packages Consumption Value by Region (2020-2031)
9.3.3 China 麻豆原创 Size and Forecast (2020-2031)
9.3.4 Japan 麻豆原创 Size and Forecast (2020-2031)
9.3.5 South Korea 麻豆原创 Size and Forecast (2020-2031)
9.3.6 India 麻豆原创 Size and Forecast (2020-2031)
9.3.7 Southeast Asia 麻豆原创 Size and Forecast (2020-2031)
9.3.8 Australia 麻豆原创 Size and Forecast (2020-2031)
10 South America
10.1 South America Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
10.2 South America Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
10.3 South America Metal Shell for Microelectronic Packages 麻豆原创 Size by Country
10.3.1 South America Metal Shell for Microelectronic Packages Sales Quantity by Country (2020-2031)
10.3.2 South America Metal Shell for Microelectronic Packages Consumption Value by Country (2020-2031)
10.3.3 Brazil 麻豆原创 Size and Forecast (2020-2031)
10.3.4 Argentina 麻豆原创 Size and Forecast (2020-2031)
11 Middle East & Africa
11.1 Middle East & Africa Metal Shell for Microelectronic Packages Sales Quantity by Type (2020-2031)
11.2 Middle East & Africa Metal Shell for Microelectronic Packages Sales Quantity by Application (2020-2031)
11.3 Middle East & Africa Metal Shell for Microelectronic Packages 麻豆原创 Size by Country
11.3.1 Middle East & Africa Metal Shell for Microelectronic Packages Sales Quantity by Country (2020-2031)
11.3.2 Middle East & Africa Metal Shell for Microelectronic Packages Consumption Value by Country (2020-2031)
11.3.3 Turkey 麻豆原创 Size and Forecast (2020-2031)
11.3.4 Egypt 麻豆原创 Size and Forecast (2020-2031)
11.3.5 Saudi Arabia 麻豆原创 Size and Forecast (2020-2031)
11.3.6 South Africa 麻豆原创 Size and Forecast (2020-2031)
12 麻豆原创 Dynamics
12.1 Metal Shell for Microelectronic Packages 麻豆原创 Drivers
12.2 Metal Shell for Microelectronic Packages 麻豆原创 Restraints
12.3 Metal Shell for Microelectronic Packages Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
13.1 Raw Material of Metal Shell for Microelectronic Packages and Key Manufacturers
13.2 Manufacturing Costs Percentage of Metal Shell for Microelectronic Packages
13.3 Metal Shell for Microelectronic Packages Production Process
13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Metal Shell for Microelectronic Packages Typical Distributors
14.3 Metal Shell for Microelectronic Packages Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology
听
听
*If Applicable.
