The global Advanced Semiconductor Packaging market size was valued at US$ 18610 million in 2024 and is forecast to a readjusted size of USD 30360 million by 2031 with a CAGR of 7.3% during review period.
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-package, etc.
Top 5 manufacturers accounted for 43.06% market share in 2019.
This report is a detailed and comprehensive analysis for global Advanced Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Advanced Semiconductor Packaging market size and forecasts, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/K Units), 2020-2031
Global Advanced Semiconductor Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/K Units), 2020-2031
Global Advanced Semiconductor Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/K Units), 2020-2031
Global Advanced Semiconductor Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (M Units), and ASP (USD/K Units), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Advanced Semiconductor Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Advanced Semiconductor Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Amkor, SPIL, Intel Corp, JCET, ASE, TFME, TSMC, Huatian, Powertech Technology Inc, UTAC, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 Segmentation
Advanced Semiconductor Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Others
麻豆原创 segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Major players covered
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos
麻豆原创 segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Advanced Semiconductor Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Advanced Semiconductor Packaging, with price, sales quantity, revenue, and global market share of Advanced Semiconductor Packaging from 2020 to 2025.
Chapter 3, the Advanced Semiconductor Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Advanced Semiconductor Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Advanced Semiconductor Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Advanced Semiconductor Packaging.
Chapter 14 and 15, to describe Advanced Semiconductor Packaging sales channel, distributors, customers, research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 麻豆原创 Analysis by Type
1.3.1 Overview: Global Advanced Semiconductor Packaging Consumption Value by Type: 2020 Versus 2024 Versus 2031
1.3.2 Fan-Out Wafer-Level Packaging (FO WLP)
1.3.3 Fan-In Wafer-Level Packaging (FI WLP)
1.3.4 Flip Chip (FC)
1.3.5 2.5D/3D
1.3.6 Others
1.4 麻豆原创 Analysis by Application
1.4.1 Overview: Global Advanced Semiconductor Packaging Consumption Value by Application: 2020 Versus 2024 Versus 2031
1.4.2 Telecommunications
1.4.3 Automotive
1.4.4 Aerospace and Defense
1.4.5 Medical Devices
1.4.6 Consumer Electronics
1.5 Global Advanced Semiconductor Packaging 麻豆原创 Size & Forecast
1.5.1 Global Advanced Semiconductor Packaging Consumption Value (2020 & 2024 & 2031)
1.5.2 Global Advanced Semiconductor Packaging Sales Quantity (2020-2031)
1.5.3 Global Advanced Semiconductor Packaging Average Price (2020-2031)
2 Manufacturers Profiles
2.1 Amkor
2.1.1 Amkor Details
2.1.2 Amkor Major Business
2.1.3 Amkor Advanced Semiconductor Packaging Product and Services
2.1.4 Amkor Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.1.5 Amkor Recent Developments/Updates
2.2 SPIL
2.2.1 SPIL Details
2.2.2 SPIL Major Business
2.2.3 SPIL Advanced Semiconductor Packaging Product and Services
2.2.4 SPIL Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.2.5 SPIL Recent Developments/Updates
2.3 Intel Corp
2.3.1 Intel Corp Details
2.3.2 Intel Corp Major Business
2.3.3 Intel Corp Advanced Semiconductor Packaging Product and Services
2.3.4 Intel Corp Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.3.5 Intel Corp Recent Developments/Updates
2.4 JCET
2.4.1 JCET Details
2.4.2 JCET Major Business
2.4.3 JCET Advanced Semiconductor Packaging Product and Services
2.4.4 JCET Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.4.5 JCET Recent Developments/Updates
2.5 ASE
2.5.1 ASE Details
2.5.2 ASE Major Business
2.5.3 ASE Advanced Semiconductor Packaging Product and Services
2.5.4 ASE Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.5.5 ASE Recent Developments/Updates
2.6 TFME
2.6.1 TFME Details
2.6.2 TFME Major Business
2.6.3 TFME Advanced Semiconductor Packaging Product and Services
2.6.4 TFME Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.6.5 TFME Recent Developments/Updates
2.7 TSMC
2.7.1 TSMC Details
2.7.2 TSMC Major Business
2.7.3 TSMC Advanced Semiconductor Packaging Product and Services
2.7.4 TSMC Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.7.5 TSMC Recent Developments/Updates
2.8 Huatian
2.8.1 Huatian Details
2.8.2 Huatian Major Business
2.8.3 Huatian Advanced Semiconductor Packaging Product and Services
2.8.4 Huatian Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.8.5 Huatian Recent Developments/Updates
2.9 Powertech Technology Inc
2.9.1 Powertech Technology Inc Details
2.9.2 Powertech Technology Inc Major Business
2.9.3 Powertech Technology Inc Advanced Semiconductor Packaging Product and Services
2.9.4 Powertech Technology Inc Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.9.5 Powertech Technology Inc Recent Developments/Updates
2.10 UTAC
2.10.1 UTAC Details
2.10.2 UTAC Major Business
2.10.3 UTAC Advanced Semiconductor Packaging Product and Services
2.10.4 UTAC Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.10.5 UTAC Recent Developments/Updates
2.11 Nepes
2.11.1 Nepes Details
2.11.2 Nepes Major Business
2.11.3 Nepes Advanced Semiconductor Packaging Product and Services
2.11.4 Nepes Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.11.5 Nepes Recent Developments/Updates
2.12 Walton Advanced Engineering
2.12.1 Walton Advanced Engineering Details
2.12.2 Walton Advanced Engineering Major Business
2.12.3 Walton Advanced Engineering Advanced Semiconductor Packaging Product and Services
2.12.4 Walton Advanced Engineering Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.12.5 Walton Advanced Engineering Recent Developments/Updates
2.13 Kyocera
2.13.1 Kyocera Details
2.13.2 Kyocera Major Business
2.13.3 Kyocera Advanced Semiconductor Packaging Product and Services
2.13.4 Kyocera Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.13.5 Kyocera Recent Developments/Updates
2.14 Chipbond
2.14.1 Chipbond Details
2.14.2 Chipbond Major Business
2.14.3 Chipbond Advanced Semiconductor Packaging Product and Services
2.14.4 Chipbond Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.14.5 Chipbond Recent Developments/Updates
2.15 Chipmos
2.15.1 Chipmos Details
2.15.2 Chipmos Major Business
2.15.3 Chipmos Advanced Semiconductor Packaging Product and Services
2.15.4 Chipmos Advanced Semiconductor Packaging Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.15.5 Chipmos Recent Developments/Updates
3 Competitive Environment: Advanced Semiconductor Packaging by Manufacturer
3.1 Global Advanced Semiconductor Packaging Sales Quantity by Manufacturer (2020-2025)
3.2 Global Advanced Semiconductor Packaging Revenue by Manufacturer (2020-2025)
3.3 Global Advanced Semiconductor Packaging Average Price by Manufacturer (2020-2025)
3.4 麻豆原创 Share Analysis (2024)
3.4.1 Producer Shipments of Advanced Semiconductor Packaging by Manufacturer Revenue ($MM) and 麻豆原创 Share (%): 2024
3.4.2 Top 3 Advanced Semiconductor Packaging Manufacturer 麻豆原创 Share in 2024
3.4.3 Top 6 Advanced Semiconductor Packaging Manufacturer 麻豆原创 Share in 2024
3.5 Advanced Semiconductor Packaging 麻豆原创: Overall Company Footprint Analysis
3.5.1 Advanced Semiconductor Packaging 麻豆原创: Region Footprint
3.5.2 Advanced Semiconductor Packaging 麻豆原创: Company Product Type Footprint
3.5.3 Advanced Semiconductor Packaging 麻豆原创: Company Product Application Footprint
3.6 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Advanced Semiconductor Packaging 麻豆原创 Size by Region
4.1.1 Global Advanced Semiconductor Packaging Sales Quantity by Region (2020-2031)
4.1.2 Global Advanced Semiconductor Packaging Consumption Value by Region (2020-2031)
4.1.3 Global Advanced Semiconductor Packaging Average Price by Region (2020-2031)
4.2 North America Advanced Semiconductor Packaging Consumption Value (2020-2031)
4.3 Europe Advanced Semiconductor Packaging Consumption Value (2020-2031)
4.4 Asia-Pacific Advanced Semiconductor Packaging Consumption Value (2020-2031)
4.5 South America Advanced Semiconductor Packaging Consumption Value (2020-2031)
4.6 Middle East & Africa Advanced Semiconductor Packaging Consumption Value (2020-2031)
5 麻豆原创 Segment by Type
5.1 Global Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
5.2 Global Advanced Semiconductor Packaging Consumption Value by Type (2020-2031)
5.3 Global Advanced Semiconductor Packaging Average Price by Type (2020-2031)
6 麻豆原创 Segment by Application
6.1 Global Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
6.2 Global Advanced Semiconductor Packaging Consumption Value by Application (2020-2031)
6.3 Global Advanced Semiconductor Packaging Average Price by Application (2020-2031)
7 North America
7.1 North America Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
7.2 North America Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
7.3 North America Advanced Semiconductor Packaging 麻豆原创 Size by Country
7.3.1 North America Advanced Semiconductor Packaging Sales Quantity by Country (2020-2031)
7.3.2 North America Advanced Semiconductor Packaging Consumption Value by Country (2020-2031)
7.3.3 United States 麻豆原创 Size and Forecast (2020-2031)
7.3.4 Canada 麻豆原创 Size and Forecast (2020-2031)
7.3.5 Mexico 麻豆原创 Size and Forecast (2020-2031)
8 Europe
8.1 Europe Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
8.2 Europe Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
8.3 Europe Advanced Semiconductor Packaging 麻豆原创 Size by Country
8.3.1 Europe Advanced Semiconductor Packaging Sales Quantity by Country (2020-2031)
8.3.2 Europe Advanced Semiconductor Packaging Consumption Value by Country (2020-2031)
8.3.3 Germany 麻豆原创 Size and Forecast (2020-2031)
8.3.4 France 麻豆原创 Size and Forecast (2020-2031)
8.3.5 United Kingdom 麻豆原创 Size and Forecast (2020-2031)
8.3.6 Russia 麻豆原创 Size and Forecast (2020-2031)
8.3.7 Italy 麻豆原创 Size and Forecast (2020-2031)
9 Asia-Pacific
9.1 Asia-Pacific Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
9.2 Asia-Pacific Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
9.3 Asia-Pacific Advanced Semiconductor Packaging 麻豆原创 Size by Region
9.3.1 Asia-Pacific Advanced Semiconductor Packaging Sales Quantity by Region (2020-2031)
9.3.2 Asia-Pacific Advanced Semiconductor Packaging Consumption Value by Region (2020-2031)
9.3.3 China 麻豆原创 Size and Forecast (2020-2031)
9.3.4 Japan 麻豆原创 Size and Forecast (2020-2031)
9.3.5 South Korea 麻豆原创 Size and Forecast (2020-2031)
9.3.6 India 麻豆原创 Size and Forecast (2020-2031)
9.3.7 Southeast Asia 麻豆原创 Size and Forecast (2020-2031)
9.3.8 Australia 麻豆原创 Size and Forecast (2020-2031)
10 South America
10.1 South America Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
10.2 South America Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
10.3 South America Advanced Semiconductor Packaging 麻豆原创 Size by Country
10.3.1 South America Advanced Semiconductor Packaging Sales Quantity by Country (2020-2031)
10.3.2 South America Advanced Semiconductor Packaging Consumption Value by Country (2020-2031)
10.3.3 Brazil 麻豆原创 Size and Forecast (2020-2031)
10.3.4 Argentina 麻豆原创 Size and Forecast (2020-2031)
11 Middle East & Africa
11.1 Middle East & Africa Advanced Semiconductor Packaging Sales Quantity by Type (2020-2031)
11.2 Middle East & Africa Advanced Semiconductor Packaging Sales Quantity by Application (2020-2031)
11.3 Middle East & Africa Advanced Semiconductor Packaging 麻豆原创 Size by Country
11.3.1 Middle East & Africa Advanced Semiconductor Packaging Sales Quantity by Country (2020-2031)
11.3.2 Middle East & Africa Advanced Semiconductor Packaging Consumption Value by Country (2020-2031)
11.3.3 Turkey 麻豆原创 Size and Forecast (2020-2031)
11.3.4 Egypt 麻豆原创 Size and Forecast (2020-2031)
11.3.5 Saudi Arabia 麻豆原创 Size and Forecast (2020-2031)
11.3.6 South Africa 麻豆原创 Size and Forecast (2020-2031)
12 麻豆原创 Dynamics
12.1 Advanced Semiconductor Packaging 麻豆原创 Drivers
12.2 Advanced Semiconductor Packaging 麻豆原创 Restraints
12.3 Advanced Semiconductor Packaging Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
13.1 Raw Material of Advanced Semiconductor Packaging and Key Manufacturers
13.2 Manufacturing Costs Percentage of Advanced Semiconductor Packaging
13.3 Advanced Semiconductor Packaging Production Process
13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Advanced Semiconductor Packaging Typical Distributors
14.3 Advanced Semiconductor Packaging Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
Amkor
SPIL
Intel Corp
JCET
ASE
TFME
TSMC
Huatian
Powertech Technology Inc
UTAC
Nepes
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos
听
听
*If Applicable.
