Global Advanced IC Substrates 麻豆原创 2021-2031 by Packaging Type , Material Type , Manufacturing Method , Bonding Technology , Application , and Region: Trend Forecast and Growth Opportunity

You are here: 麻豆原创 Catalog Computing & Electronics Semiconductors Electrical Components

Global Advanced IC Substrates 麻豆原创 2021-2031 by Packaging Type , Material Type , Manufacturing Method , Bonding Technology , Application , and Region: Trend Forecast and Growth Opportunity

麻豆原创 Research Report Summary

Global Advanced IC Substrates 麻豆原创 2021-2031 by Packaging Type , Material Type , Manufacturing Method , Bonding Technology , Application , and Region: Trend Forecast and Growth Opportunity report is published on September 30, 2022 and has 165 pages in it. This market research report provides information about Semiconductors, Electrical Components, Computing & Electronics industry. It covers Global market data and forecasts. It is priced starting at USD 3,200.00 for Single User License (PDF) which allows one person to use this report.

Please read the description and table of contents of this research report given below to check whether it meets your research requirements. If not, then please do not hesitate to contact us using "Report Enquiry" form given below. We can customize this research report or suggest a new fully customized market research report to meet your research goals and data requirements.

Global Advanced IC Substrates 麻豆原创 2021-2031 by Packaging Type , Material Type , Manufacturing Method , Bonding Technology , Application , and Region: Trend Forecast and Growth Opportunity

Printer version

Send by email

Publication ID:听

GRM0922018

Publication Date:听

September 30, 2022

笔补驳别蝉:听

165

笔耻产濒颈蝉丑别谤:听

Grace 麻豆原创 Data

颁辞耻苍迟谤颈别蝉:听

Global

USD 3,200.00

Pay By Invoice

If you wish to purchase this report using bank/wire transfer against an invoice, please fill your details using request invoice form given below.

Globally Trusted Brand

We help executives from firms听to Start-ups听with their market research needs thus听we can help you too.听

Secure Checkout

You can shop confidently as your online payments are processed using PCI DSS compliant secure payment gateways on our website.

Frequently Asked Questions

If you have any pre-sales听questions related to this report please let us know using the "Report Enquiry" form below. This will help us provide you听with answers听so that you can purchase with confidence. If you wish to read about frequently asked questions by our customers please visit our .

Tabs

Description

Global advanced IC substrates market will reach $16,953.8 million by 2031, growing by 7.1% annually over 2021-2031, driven by the rising adoption of advanced substrates in manufacturing of electronics, the increasing prevalence and functionality of consumer electronic products such as smart devices and smart wearables, and the increasing penetration of advanced technologies such as 5G and IoT connected devices.
Highlighted with 82 tables and 82 figures, this 165-page report 鈥淕lobal Advanced IC Substrates 麻豆原创 2021-2031 by Packaging Type (FC BGA, FC CSP, Others), Material Type (Rigid, Flex, Ceramic), Manufacturing Method (SP, AP, MSAP), Bonding Technology (Wire Bonding, FC Bonding, TAB), Application (Mobile and Consumer Electronics, Automotive and Transportation, IT and Telecom, Others), and Region: Trend Forecast and Growth Opportunity.鈥� is based on a comprehensive research of the entire global advanced IC substrates market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
鈥� 麻豆原创 Structure
鈥� Growth Drivers
鈥� Restraints and Challenges
鈥� Emerging Product Trends & 麻豆原创 Opportunities
鈥� Porter鈥檚 Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global advanced IC substrates market in every aspect of the classification from perspectives of Packaging Type, Material Type, Manufacturing Method, Bonding Technology, Application, and Region.

Based on Packaging Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� FC BGA
鈥� FC CSP
鈥� Other Packaging Types

Based on Material Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Rigid Integrated Circuit Substrate
鈥� Flex Integrated Circuit Substrate
鈥� Ceramic Integrated Circuit Substrate

By Manufacturing Method, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Subtraction Process (SP)
鈥� Addition Process (AP)
鈥� Modified Semi-additive Process (MSAP)

By Bonding Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Wire Bonding
鈥� FC Bonding
鈥� Tape Automated Bonding (TAB)

By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Mobile and Consumer Electronics
鈥� Automotive and Transportation
鈥� IT and Telecom
鈥� Other Applications

Geographically, the following regions together with the listed national/local markets are fully investigated:
鈥� North America (U.S., Canada, and Mexico)
鈥� Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
鈥� APAC (Japan, China, South Korea, Australia, Taiwan, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, India, and Philippines)
鈥� South America (Brazil, Chile, Argentina, Rest of South America)
鈥� MEA (UAE锛孲audi Arabia锛� South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Packaging Type, Material Type and Application over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Table of Contents

1 Introduction 9
1.1 Industry Definition and Research Scope 9
1.1.1 Industry Definition 9
1.1.2 Research Scope 10
1.2 Research Methodology 13
1.2.1 Overview of 麻豆原创 Research Methodology 13
1.2.2 麻豆原创 Assumption 14
1.2.3 Secondary Data 14
1.2.4 Primary Data 14
1.2.5 Data Filtration and Model Design 15
1.2.6 麻豆原创 Size/Share Estimation 16
1.2.7 Research Limitations 17
1.3 Executive Summary 18
2 麻豆原创 Overview and Dynamics 21
2.1 麻豆原创 Size and Forecast 21
2.1.1 Impact of COVID-19 on World Economy 22
2.1.2 Impact of COVID-19 on the 麻豆原创 27
2.2 Major Growth Drivers 29
2.3 麻豆原创 Restraints and Challenges 34
2.4 Emerging Opportunities and 麻豆原创 Trends 37
2.5 Porter鈥檚 Fiver Forces Analysis 41
3 Segmentation of Global 麻豆原创 by Packaging Type 45
3.1 麻豆原创 Overview by Packaging Type 45
3.2 FC BGA 47
3.3 FC CSP 48
3.4 Other Packaging Types 49
4 Segmentation of Global 麻豆原创 by Material Type 50
4.1 麻豆原创 Overview by Material Type 50
4.2 Rigid Integrated Circuit Substrate 52
4.3 Flex Integrated Circuit Substrate 53
4.4 Ceramic Integrated Circuit Substrate 54
5 Segmentation of Global 麻豆原创 by Manufacturing Method 55
5.1 麻豆原创 Overview by Manufacturing Method 55
5.2 Subtraction Process (SP) 57
5.3 Addition Process (AP) 58
5.4 Modified Semi-additive Process (MSAP) 59
6 Segmentation of Global 麻豆原创 by Bonding Technology 60
6.1 麻豆原创 Overview by Bonding Technology 60
6.2 Wire Bonding 62
6.3 FC Bonding 64
6.4 Tape Automated Bonding (TAB) 66
7 Segmentation of Global 麻豆原创 by Application 67
7.1 麻豆原创 Overview by Application 67
7.2 Mobile and Consumer Electronics 69
7.3 Automotive and Transportation 70
7.4 IT and Telecom 71
7.5 Other Applications 72
8 Segmentation of Global 麻豆原创 by Region 73
8.1 Geographic 麻豆原创 Overview 2021-2031 73
8.2 North America 麻豆原创 2021-2031 by Country 77
8.2.1 Overview of North America 麻豆原创 77
8.2.2 U.S. 81
8.2.3 Canada 84
8.2.4 Mexico 86
8.3 European 麻豆原创 2021-2031 by Country 88
8.3.1 Overview of European 麻豆原创 88
8.3.2 Germany 92
8.3.3 U.K. 94
8.3.4 France 96
8.3.5 Spain 98
8.3.6 Italy 100
8.3.7 Netherlands 102
8.3.8 Rest of European 麻豆原创 104
8.4 Asia-Pacific 麻豆原创 2021-2031 by Country/Region 106
8.4.1 Overview of Asia-Pacific 麻豆原创 106
8.4.2 Japan 110
8.4.3 China 113
8.4.4 Australia 115
8.4.5 Taiwan 117
8.4.6 South Korea 119
8.4.7 Rest of APAC Region 121
8.5 South America 麻豆原创 2021-2031 by Country 123
8.5.1 Argentina 126
8.5.2 Brazil 128
8.5.3 Chile 130
8.5.4 Rest of South America 麻豆原创 132
8.6 MEA 麻豆原创 2021-2031 by Country 133
8.6.1 UAE 136
8.6.2 Saudi Arabia 138
8.6.3 South Africa 140
8.6.4 Other National 麻豆原创s 142
9 Competitive Landscape 143
9.1 Overview of Key Vendors 143
9.2 New Product Launch, Partnership, Investment, and M&A 146
9.3 Company Profiles 147
ASE Group 147
AT&S Austria Technologie & Systemtechnik AG 149
Fujitsu Ltd. 150
IBIDEN Co., Ltd. 151
Kinsus Interconnect Technology Corp. 152
Korea Circuit Co., Ltd. 153
KYOCERA Corporation 154
LG Innotek Co., Ltd. 155
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation) 156
Shenzhen Fastprint Circuit Tech 157
Shinko Electric Industries Co., Ltd. 158
Siliconware Precision Industries Co., Ltd. 159
STATS ChipPAC Pte. Ltd. 160
TTM Technologies Inc. 161
Unimicron Corporation 162
Zhen Ding Technology Holding Ltd. 163
Zhuhai ACCESS Semiconductor 164
RELATED REPORTS 165

Companies Covered

Selected Key Players:
ASE Group
AT&S Austria Technologie & Systemtechnik AG
Fujitsu Ltd.
IBIDEN Co., Ltd.
Kinsus Interconnect Technology Corp.
Korea Circuit Co., Ltd.
KYOCERA Corporation
LG Innotek Co., Ltd.
Nan Ya PCB Co., Ltd. (Nan Ya Plastics Corporation)
Shenzhen Fastprint Circuit Tech
Shinko Electric Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd.
STATS ChipPAC Pte. Ltd.
TTM Technologies Inc.
Unimicron Corporation
Zhen Ding Technology Holding Ltd.
Zhuhai ACCESS Semiconductor
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Report License Types

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

Enquiry / Request Invoice

Report Inquiry

Do you have more questions related to this market research report after going through the description and table of contents?

We are here to help. Please use the form given below to let us know your questions related to this report.

Kindly use your official email address and contact number to ensure speedy response.

First Name *

Last Name *

Company *

Email Address *

Phone (Including International Code) *

Report Title *

Do you need invoice for purchasing this report? *

Address 1

Address 2

City/Town

Postal/Zip Code

Country

License Type

Your Inquiry *

CAPTCHA

This question is for testing whether you are a human visitor and to prevent automated spam submissions.

Semiconductors

Electrical Components

Computing & Electronics

*Please note that the report cover image shown above is for representation purpose only. Actual report cover may vary.

听

Related 麻豆原创 Research Reports

Publication	Price
Global Semiconductor Strain Gauge Sensors 麻豆原创 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031 The global Semiconductor Strain Gauge Sensors market size was valued at US$ 33.9 million in 2024 and is forecast to a readjusted size of USD 52.2 million by 2031 with a CAGR of 6.4% during review period. As opposed to other types of strain gages, semiconductor strain gages depend on the piezoresistive effects of silicon or germanium and measure the change in resistance with stress as opposed to strain. The semiconductor bonded strain gage is a wafer with the resistance element diffused into a substrate of silicon. It is widely used as sense element for transducer manufacturing and engineering stress analysis, Semiconductor Strain Gauges are not only used for surveying stress distribution, or static measurement for machinery, ships, bridges, aviation, but also used for non-linearity compensation of force transducers. BCM SENSOR TECHNOLOGIES, Micron Instrument, Kyowa Electronic Instruments and HT SENSOR TECHNOLOGY are the leaders of the Semiconductor Strain Gauge Sensors...Read more	USD 3,480.00
Global RF Coaxial Cable Assemblies 麻豆原创 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031 The global RF Coaxial Cable Assemblies market size was valued at US$ 4206 million in 2024 and is forecast to a readjusted size of USD 6564 million by 2031 with a CAGR of 6.6% during review period. RF coaxial cable assemblies are assembled together by RF coaxial connectors and cables. RF coaxial cable assemblies are mainly used to connect all kinds of signal transceiver equipment or transmitter, ensuring that the signal during transmission precision, low loss, high efficiency, high quality. RF coaxial cable assemblies are widely used in field of telecom, computer & peripherals, military, aerospace, medical, test and so on. Global RF Coaxial Cable Assemblies key players include Molex, TE Connectivity, ZTT, Gore, Rosenberger GmbH, etc. Global top five manufacturers hold a share over 30%. North America is the largest market, with a share over 30%, followed by China, and Europe, both have a share about 40 percent. In terms of product, Semi-Flexible Type...Read more	USD 3,480.00
Global E-passport and E-visa 麻豆原创 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031 The global E-passport and E-visa market size was valued at US$ 12790 million in 2024 and is forecast to a readjusted size of USD 19460 million by 2031 with a CAGR of 6.2% during review period. E-passport is an electronic passport with high security printing, an inlay including an antenna and a microprocessor, and other security features. An E-passport is a biometric passport which includes a chip, which can be used at the automated E-passport gates instead of having your passport checked by a Border Force officer. The chip holds the same information that is printed on the passport鈥檚 data page: the holder鈥檚 name, date of birth, and other biographic information. In some countries, including Germany, E-passport include two fingerprints as well. An electronic visa (E-visa) is one of visa types issued to foreigners by Immigration Department via electronic system. E-visa, also known as e-visa, refers to the "electronic" of traditional paper visas. All information on...Read more	USD 3,480.00
Global Static Random Access Memory (SRAM) 麻豆原创 2025 by Company, Regions, Type and Application, Forecast to 2031 The global Static Random Access Memory (SRAM) market size was valued at US$ 375 million in 2024 and is forecast to a readjusted size of USD 322 million by 2031 with a CAGR of -2.1% during review period. SRAM (static RAM) is random access memory (RAM) that retains data bits in its memory as long as power is being supplied. Unlike dynamic RAM (DRAM), which stores bits in cells consisting of a capacitor and a transistor, SRAM does not have to be periodically refreshed. Static RAM provides faster access to data and is more expensive than DRAM. SRAM is used for a computer"s cache memory and as part of the random access memory digital-to-analog converter on a video card. The global static random access memory (SRAM) market is dominated by Cypress, Renesas, ISSI, etc. The top three players account for about 80% of the market share. The United States is the largest market for static random access memory (SRAM) with a market share of about 80 percent, followed by...Read more	USD 3,480.00
Global 2-In-1 Laptops 麻豆原创 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031 The global 2-In-1 Laptops market size was valued at US$ 36980 million in 2024 and is forecast to a readjusted size of USD 55910 million by 2031 with a CAGR of 6.2% during review period. A 2-in-1 PC, also known as a 2-in-1 tablet, 2-In-1 Laptops, 2-in-1 detachable laplet, or simply 2-in-1, is a portable computer that shares characteristics of both tablets and laptops. Before the emergence of 2-in-1s, the terms convertible and hybrid were already in use by technology journalists. The term convertible typically referred to 2-in-1 PCs that featured some type of keyboard concealment mechanism that allowed the keyboard to be slid or rotated behind the back of the chassis, while the term hybrid typically referred to devices that featured a hot-pluggable complimentary keyboard. Global 5 largest manufacturers of 2-In-1 Laptops are Apple, HP, Microsoft, Lenovo and Asus, which make up over 65%. Among them, Apple dominates with nearly 25% production value share, followed by HP (15...Read more	USD 3,480.00

Clients Who Trust Us

Need tailor made market research solution? We can help you with that too.

Contact Us

About Us

At 麻豆原创 we aim to make it easier for decision makers to find relevant information and locate right market research reports which can save their time and assist in what they do best, i.e. take time-critical decisions.

We work with our associate Global market research firms who are known leaders in their respective domains to obtain right market research solution for our customer鈥檚 needs, be it custom research or syndicated research reports.

Contact Us

麻豆原创 Research Reports, Inc
16192 Coastal Hwy
Lewes, DE 19958, USA

USA: +1-302-703-9904

India: +91-8762746600

marketresearchreports

info@marketresearchreports.com

Latest Blog Posts

Stay Connected

Disclaimer: 麻豆原创 has no affiliation to, and is not associated with any other website(s) or organization(s). We offer syndicated research reports (like country analysis, SWOT analysis, competitive intelligence, industry reports, company reports and market analysis & trends reports) and custom market research from our website 麻豆原创ResearchReports.com only.

If you are looking for a market research solution for your research requirements, please begin your search using the search box on top of this page or use our chat system to speak to our market research consultants or directly write to us.

麻豆原创