Blog: 18 April 2023
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- 18 Apr
ABF (Ajinomoto Build-up Film) Substrate market is Estimated to reach USD 9.33 billion by 2029
Ajinomoto Build-up Film (ABF) is a specialized packaging material used in the electronics industry to produce printed circuit boards (PCBs). ABF is a multilayer film composed of various materials, including polyimide, adhesive, and copper. Several factors, such as increasing demand for high-...